Dr. Yazan A Alqudah

In one embodiment, a method to analyze a semiconductor wafer comprises extracting inline defect data from a data source, counting a total number of inline defects and end-of-line defects, terminating the analysis when the total number of inline defects and end-of-line defects exceeds a threshold, and mapping the inline defects onto the end-of-line defects when the total number of inline defects and end-of-line defects is less than a threshold.

There is provided a system, method, and a computer program product that, when implemented, provides a user a notification about one or more road conditions. The system may include one or more sensors that may be configured to detect the presence and absence of one or more road markings, and a processing unit in operable communication with the one or more sensors configured to receive and process a plurality of sensor readings provided by the one or more sensors. A display in operable communication with the processing unit may be configured to display audio