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Journal article
Investigation of electronic assembly design alternatives through production modeling of life cycle impacts, costs, and yield
IEEE Transactions on Components. Packaging and Manufacturing Technology, Part C: Technology, Vol.20, pp.317-326
20
1997
Abstract
Environmental legislation, technological advances and increasingly competitive global markets have led to a number of different product and process design choices for electronics assemblies. Decision tools to aid in the selection of a product and process design have been limited to qualitative methodologies. In addition, trade-offs between environmental impacts, yield, and reliability have not been analyzed. In this paper, electronic assembly product and process design alternatives are investigated using a quantitative methodology with life cycle considerations for environmental impacts. These impacts include energy usage, material consumption, waste generation, process yield, and product reliability.
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Details
- Title
- Investigation of electronic assembly design alternatives through production modeling of life cycle impacts, costs, and yield
- Publication Details
- IEEE Transactions on Components. Packaging and Manufacturing Technology, Part C: Technology, Vol.20, pp.317-326
- Resource Type
- Journal article
- Publisher
- IEEE/Institute of Electrical and Electronics Engineers; United States
- Series
- 20
- Copyright
- © 1997 IEEE
- Identifiers
- 99380090616706600
- Academic Unit
- Business Administration; Lewis Bear Jr. College of Business
- Language
- English